| Outline: This equipment is the TMT handler of semiconductor device
known as discrete products (MELF/leadless diodes) in which it is
being tested, marked and taped. The method which a glass leadless
diode was picked thru a turret and being tested, and feed to the
marking wheel which the cathode bond was marked and being drop to
the conveyor to cure. It is being pick thru a magnet and feed to
the bowl, the turret pick-up again and tested before feeding to the
taping station. This equipment is a fully automatic handler driven
with PLC, cam and gearbox principally intended for testing, marking
and taping. Features: The object of this equipment is "Testing, Marking and Taping". This handler is equipped with touch screen monitor who gives the users easily to edit data and parameters. The brushless AC servo motor is used to drive the main turret assembly which is known as maintenance free motor. The position can be easily detected more precisely and more quickly on the touch screen by the means of encoder. The reverse marked problem can be eliminated by introducing a test point before marking and being blown out to the chute without stopping the operation thereby not affecting the productivity. Main specifications Handling system Testing, marking, taping Machine speed Ranging from 18-20 kph depending on device loaded No. Of cathode bond capable of dual bond No. Of pick-up heads 24 heads Vacuum requirements 600-800 mbar / -21 in-Hg or less CDA requirements 3-5 bars Input power source 220 VAC 50/60 Hz Power consumption 3.0 kVA |
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